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X 電容自動放電芯片, CAP300DG替代型號推薦 ME8701.
FEATURES
? 內置 1000V MOSFET
? AC 電(dian)壓接入后阻止(zhi) X 電(dian)容放電(dian)
? AC 電(dian)壓斷(duan)電(dian)后通過放電(dian)電(dian)阻對 X 電(dian)容(rong)放電(dian)
? 功率損耗<5mW@230VAC
? X 電容容值靈活調節,簡化(hua) EMI 濾(lv)波電路(lu)設計
? 自供電(dian),無需(xu)外部偏置
? 兩端子(zi)結構,滿足安規(gui)標準
? 內部限制最大(da)放(fang)電電流









PIN CONFIGUTION
優勢替代
CAP300DG CAP300DG.pdf

No.14415

FEATURES

? Provides lossless ZC (Zero Crossing) signal to system MCU

? Meets IEC 60335 X capacitor discharge of <34 V in <1 sec
? One part to cover X capacitor values up to 6 mF
? Blocks current through X capacitor discharge resistors when 
  AC voltage is connected
? Automatically discharges X capacitors through discharge 
  resistors when AC is disconnected
? Simplifies EMI filter design – larger X capacitor allows smaller
  inductive components with no change in consumption
? Only two terminals – meets safety standards for use before 
  or after system input fuse
? >4 mm creepage on package and PCB
? Self supplied – no external bias required
? High common mode surge immunity – no external ground 
  connection
? High differential surge withstand – 1000 V internal MOSFETs
? NEMKO and CB certification
PIN CONFIGUTION
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